4 inch wafer

Short Name:

4"

The following is a list of equipment where 4 inch round substrates are allowed.

Equipment Tables

Equipment name & NEMO ID	Training Required & Charges	Cleanliness	Location	Notes
Wet Bench Clean_res-piranha wbclean_res-piranha	Wet Bench Clean Piranha/HF/Phosphoric Training	Clean	SNF Paul G Allen L107 Cleanroom	Resist will be removed
EVG 101 Spray Coater evgspraycoat	Spray Coater EVG 101 Training	"All"	SNF Paul G Allen L107 Cleanroom	Spray coating of resists
Technics Asher technics	Technics Asher Training	Flexible	SNF Paul G Allen L107 Cleanroom
Tystar Bank 1 Tube 4 LTO B1T4 Flexible LTO	Tystar LPCVD Tube Training	Flexible	SNF Paul G Allen L107 Cleanroom
AMAT Centurion Epitaxial System epi2	Epitaxial AMAT Centurion Training	Clean	SNF Paul G Allen L107 Cleanroom	N and P doping available- intrinsic to 5E19 Operating pressure range is 5-300Torr
Wet Bench Flexcorr 3 wbflexcorr-3	Wet Bench Flexcorr 1and2 and 3and4 Training	Flexible	SNF Paul G Allen L107 Cleanroom	Manual wet etching of non-standard materials using acids or bases. Hot Plate available. GaAs not allowed.
SVG Resist Coat Track 1 svgcoat	SVG Resist Coat Tracks 1 and 2 Training	"All"	SNF Paul G Allen L107 Cleanroom	Automatic Resist spinning and bake
Samco PC300 Plasma Etch System samco	Samco Training	Flexible	SNF Paul G Allen L107 Cleanroom
Tystar Bank 3 Tube 11 TEOS B3T11 Clean TEOS	Tystar LPCVD Tube Training	Clean	SNF Paul G Allen L107 Cleanroom
PlasmaTherm Shuttlelock PECVD System ccp-dep	PlasmaTherm Shuttlelock PECVD System Training	"All"	SNF Paul G Allen L107 Cleanroom	To maintain cleanliness level, cleans of both the chamber and wafers are required prior to processing - Substrates in clean category: Pre-Diffusion Clean For semi-clean substrates: Standard Metal Clean (SRS100 + PRS1000) . Run Chamber clean (no dummies) and conditioning with clean dummies prior to run
Wet Bench Flexible Solvents wbflexsolv	Wet Bench Flexible Solvents 1 and 2 Training	Flexible	SNF Paul G Allen L107 Cleanroom	Manual solvent cleaning of substrates or resist removal.
SPTS uetch vapor etch uetch	SPTS uetch vapor etch Training	"All"	SNF Paul G Allen L107 Cleanroom	Pieces need a carrier wafer; Isotropic Etching
Flexus 2320 Stress Tester stresstest	Stress Tester Flexus 2320 Training	"All"	SNF Paul G Allen L107 Cleanroom
Lesker2 Sputter lesker2-sputter	Sputter Lesker 1&2 Training	Semiclean	SNF Paul G Allen L107 Cleanroom	reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter
Tystar Bank 2 Tube 8 LTO B2T8 Clean LTO	Tystar LPCVD Tube Training	Clean	SNF Paul G Allen L107 Cleanroom
PlasmaTherm Versaline HDP CVD System hdpcvd	PlasmaTherm Versaline HDP CVD System Training	"All"	SNF Paul G Allen L107 Cleanroom	To maintain cleanliness level there are cleans required for both the chamber and wafers prior to processing - Substrates in clean category: Pre-Diffusion Clean For semi-clean substrates: Standard Metal Clean (SRS100 + PRS1000) . Run Chamber clean (no dummies) and conditioning with clean dummies prior to run
Critical Point Dryer Tousimis Automegasamdri-936 cpd	Critical Point Dryer Training	Flexible	SNF Paul G Allen L107 Cleanroom	CO2 drying after release of micromachined devices
HMDS Vapor Prime Oven, YES yes	YES Prime Oven Training	"All"	SNF Paul G Allen L107 Cleanroom	Two programs: Singe and HMDS prime or Singe only. No Resist allowed!
AJA2 Evaporator aja2-evap	Evaporator AJA2 Training	Flexible	SNF Paul G Allen L107 Cleanroom	For more than 300nm deposition, please contact Gabe Catalano <gcatalano@stanford.edu> in advance
CHA Solutions II Evaporator cha-evap	Evaporator CHA Training	Flexible	SNF Paul G Allen L107 Cleanroom	For more than 300nm deposition, please contact Neel Mehta <nmehta26@stanford.edu> in advance

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