Wet Bench Clean_res- hotphos wbclean_res-hotphos |
Wet Bench Clean Piranha/HF/Phosphoric Training |
Clean |
SNF Paul G Allen L107 Cleanroom |
Resist should have been removed
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Wet Bench Clean 1 wbclean-1 |
Wet Bench Clean1and2 Training |
Clean |
SNF Paul G Allen L107 Cleanroom |
No resist allowed. Resist should have been removed at the wbclean_res-piranha.
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Oven (White) white-oven |
White Oven Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
For LOL2000 bake or bakes which are not allowed in the other ovens and need higher temperatures, up to 200C, programmable.
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Intlvac Evaporator Intlvac_evap |
Evaporator Intlvac Training |
Clean, Semiclean |
SNF Paul G Allen L107 Cleanroom |
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Oxford Plasma Pro ICP-RIE ALE Ox-ALE |
Oxford Plasma Pro ICP-RIE ALE Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
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Wet Bench Flexcorr 1 wbflexcorr-1 |
Wet Bench Flexcorr 1and2 and 3and4 Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only.
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MRC Reactive Ion Etcher mrc |
MRC Reactive Ion Etcher Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
Typically used for sputter etching; Single wafer, direct load system; wafers/ pieces can be directly placed on electrode
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Oven BlueM 200°C to 430°C bluem |
Blue M Oven Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
Convection in N2. Cure. Programmable.
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SVG Resist Coat Track 2 svgcoat2 |
SVG Resist Coat Tracks 1 and 2 Training |
"All" |
SNF Paul G Allen L107 Cleanroom |
Automatic HMDS, Resist spinning, and Bake. AZ5214IR Image Reversal.
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Tystar Bank 1 Tube 2 B1T2 Flexible Oxide |
Tystar Atmospheric Tube Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
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micromanipulator6000 IV-CV probe station micromanipulator6000 |
micromanipulator6000 IV-CV probe station Training |
"All" |
SNF Exfab Paul G Allen 151 Ocean |
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Sinton Lifetime Tester sinton-lifetime-tester |
Sinton Lifetime Tester Training |
Flexible |
SNF Exfab Paul G Allen 151 Ocean |
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LEI1500 Contactless Sheet Resistance Mapping eddycurrent |
LEI1500 Contactless Sheet Resistance Mapping Training |
"All" |
SNF Exfab Paul G Allen 151 Ocean |
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DISCO Wafer Saw DISCO wafersaw |
Wafersaw DISCO training |
Flexible |
SNF Exfab Paul G Allen 159 Capitola |
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Plasmaetch PE-50 plasma-etch |
Plasmaetch PE-50 Training |
Flexible |
SNF Exfab Paul G Allen 155A Venice |
Low power, high pressure plasma; low bias, minimal damage. Often used for surface treatment.
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Lesker Sputter lesker-sputter |
Sputter Lesker 1&2 Training |
Flexible |
SNF Exfab Paul G Allen 155A Venice |
reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter
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AJA Evaporator aja-evap |
Evaporator AJA training |
Flexible |
SNF Exfab Paul G Allen 155A Venice |
For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance
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First Nano carbon nanotube CVD furnace cvd-nanotube |
cvd-nanotube training |
Flexible |
SNF Exfab Paul G Allen L119 Año Nuevo |
Aligned single-walled carbon nanotube growth with ST-cut quartz substrates (available from SNF stockroom);1-15 single-walled carbon nanotubes per micron density
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Aixtron Black Magic graphene CVD furnace aixtron-graphene |
CVD graphene furnace Aixtron Black Magic training |
Flexible |
SNF Exfab Paul G Allen L119 Año Nuevo |
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Aixtron MOCVD - III-N system aix-ccs |
MOCVD - III-N Aixtron training |
Clean (MOCVD) |
SNF MOCVD Paul G Allen 213XA |
N and P doping available.
For Si clean: SC1, SC2, HF dip.
For Sapphire clean: SC1, SC2.
For GaN template on Si or Sapphire: Piranha, SC1, SC2.
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