The following is a list of equipment where 4 inch round substrates are allowed.
Isotropic Si etching; can be used for backside Si removal on small pieces
Wet Resist Removal: SRS-100 or PRS1000
Manual development of resist in beakers and Headway (manual resist spinner). SNF approved developers (acid or base). No solvents!
Manual solvent cleaning, two ultrasonic baths.
Manual solvent cleaning, hot plate
Manual solvent cleaning of substrates or resist removal.
Manual wet etching of non-standard materials using acids or bases. Hot plate, HF bath, and controlled temperature bath available. GaAs not allowed.
Manual wet etching of non-standard materials using acids or bases. Hot Plate available. GaAs not allowed.
Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only.
Manual wet etching of non-standard materials. Hot pots available. GaAs allowed in personal labware only
Al, Ti, or W wet etching or oxide etching
Resist as mask allowed
Resist will be removed
Resist should have been removed
Manual development of resist in beakers. SNF approved developers only. No solvents!
Automatic development.
Automatic Resist spinning and bake
Automatic HMDS, Resist spinning, and Bake. AZ5214IR Image Reversal.