The following is a list of equipment where 4 inch round substrates are allowed.
No resist allowed. Resist should have been removed at the wbclean_res-piranha
reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter
KOH or wafersaw or post-cmp decontamination
Direct Write
For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance
To maintain cleanliness level there are cleans required for both the chamber and wafers prior to processing -
Substrates in clean category: Pre-Diffusion Clean
For semi-clean substrates: Standard Metal Clean (SRS100 + PRS1000) . Run Chamber clean (no dummies) and conditioning with clean dummies prior to run
For LOL2000 bake or bakes which are not allowed in the other ovens and need higher temperatures, up to 200C, programmable.
non contact 3D optical profiling
Two programs: Singe and HMDS prime or Singe only. No Resist allowed!