Equipment name & NEMO ID |
Training Required & Charges![]() |
Cleanliness | Location | Notes |
---|---|---|---|---|
CHA Solutions II Evaporator cha-evap |
Evaporator CHA Training | Flexible | SNF Paul G Allen L107 Cleanroom |
For more than 300nm deposition, please contact Neel Mehta <nmehta26@stanford.edu> in advance |
KJL Evaporator 1 | KJL Evaporator 1 Training | SNSF NPC Spilker suite 6 | ||
Oxford Plasma Pro ICP-RIE ALE Ox-ALE |
Oxford Plasma Pro ICP-RIE ALE Training | Flexible | SNF Paul G Allen L107 Cleanroom | |
Oxford Plasma Pro ICP-RIE Ox Ox-Ox |
Oxford Plasma Pro ICP-RIE Ox Training | Clean | SNF Paul G Allen L107 Cleanroom | |
Oxford Plasma Pro PECVD Ox-PECVD |
Oxford Plasma Pro PECVD Training | Semiclean, Flexible | SNF Paul G Allen L107 Cleanroom |
Equipment name & NEMO ID | Technique | Cleanliness | Primary Materials Etched | Developer | Process Temperature Range | Chemicals | Gases | Substrate Size | Substrate Type | Maximum Load |
---|---|---|---|---|---|---|---|---|---|---|
Wet Bench Miscellaneous wbmiscres |
Flexible |
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Wet Bench Resist Strip wbresstrip-1 |
Clean (Ge), Semiclean, Flexible |
20 °C - 60 °C
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25 4 inch wafers | ||||||
Wet Bench Solvent Lithography lithosolv |
Flexible |
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Woollam woollam |
"All" |
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1 | |||||||
Xactix Xenon Difluoride Etcher xactix |
"All" |
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1 |