The following is a list of equipment where 4 inch round substrates are allowed.
Isotropic Si etching; can be used for backside Si removal on small pieces
Manual solvent cleaning of substrates or masks. Teflon coated metal tweezers cleaning.
Wet Resist Removal: SRS-100 or PRS1000
Manual development of resist in beakers and Headway (manual resist spinner). SNF approved developers (acid or base). No solvents!
Manual solvent cleaning, hot plate
Manual solvent cleaning, two ultrasonic baths.
Manual solvent cleaning of substrates or resist removal.
Manual wet etching of non-standard materials using acids or bases. Hot plate, HF bath, and controlled temperature bath available. GaAs not allowed.
Manual wet etching of non-standard materials using acids or bases. Hot Plate available. GaAs not allowed.
Manual wet etching of non-standard materials. Hot pots available. GaAs allowed in personal labware only
Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only.
KOH or wafersaw or post-cmp decontamination
Al, Ti, or W wet etching or oxide etching
Resist will be removed
Resist as mask allowed
Resist should have been removed
No resist allowed. Resist should have been removed at the wbclean_res-piranha
No resist allowed. Resist should have been removed at the wbclean_res-piranha.