The following is a list of equipment where 4 inch round substrates are allowed.
Manual solvent cleaning, hot plate
Manual solvent cleaning of substrates or resist removal.
Manual development of resist in beakers and Headway (manual resist spinner). SNF approved developers (acid or base). No solvents!
Wet Resist Removal: SRS-100 or PRS1000
Isotropic Si etching; can be used for backside Si removal on small pieces
Two programs: Singe and HMDS prime or Singe only. No Resist allowed!
non contact 3D optical profiling
For LOL2000 bake or bakes which are not allowed in the other ovens and need higher temperatures, up to 200C, programmable.
To maintain cleanliness level there are cleans required for both the chamber and wafers prior to processing -
Substrates in clean category: Pre-Diffusion Clean
For semi-clean substrates: Standard Metal Clean (SRS100 + PRS1000) . Run Chamber clean (no dummies) and conditioning with clean dummies prior to run
For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance
Direct Write
KOH or wafersaw or post-cmp decontamination