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4 inch wafer

Short Name: 
4"

The following is a list of equipment where 4 inch round substrates are allowed.

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Equipment name & NEMO ID Training Required & Charges Cleanliness Locationsort descending Notes
Heidelberg MLA 150 - 2
heidelberg2
Heidelberg Training All SNF Paul G Allen L107 Cleanroom

Direct Write

Tystar Bank 2 Tube 7 Nitride
B2T7 Clean Nitride
Tystar LPCVD Tube Training Clean SNF Paul G Allen L107 Cleanroom
AMAT Centurion Epitaxial System
epi2
Epitaxial AMAT Centurion Training Clean SNF Paul G Allen L107 Cleanroom

N and P doping available- intrinsic to 5E19 Operating pressure range is 5-300Torr

Wet Bench Flexcorr 3
wbflexcorr-3
Wet Bench Flexcorr 1and2 and 3and4 Training Flexible SNF Paul G Allen L107 Cleanroom

Manual wet etching of non-standard materials using acids or bases. Hot Plate available. GaAs not allowed.

SVG Resist Coat Track 1
svgcoat
SVG Resist Coat Tracks 1 and 2 Training All SNF Paul G Allen L107 Cleanroom

Automatic Resist spinning and bake

Technics Asher
technics
Technics Asher Training Flexible SNF Paul G Allen L107 Cleanroom
Tystar Bank 1 Tube 4 LTO
B1T4 Flexible LTO
Tystar LPCVD Tube Training Flexible SNF Paul G Allen L107 Cleanroom
PlasmaTherm Shuttlelock PECVD System
ccp-dep
PlasmaTherm Shuttlelock PECVD System Training All SNF Paul G Allen L107 Cleanroom

To maintain cleanliness level, cleans of both the chamber and wafers are required prior to processing -

Substrates in clean category: Pre-Diffusion Clean

For semi-clean substrates: Standard Metal Clean (SRS100 + PRS1000) . Run Chamber clean (no dummies) and conditioning with clean dummies prior to run

Wet Bench Flexible Solvents
wbflexsolv
Wet Bench Flexible Solvents 1 and 2 Training Flexible SNF Paul G Allen L107 Cleanroom

Manual solvent cleaning of substrates or resist removal.

SPTS uetch vapor etch
uetch
SPTS uetch vapor etch Training All SNF Paul G Allen L107 Cleanroom

Pieces need a carrier wafer; Isotropic Etching

Prometrix Resistivity Mapping System
prometrix
Prometrix Training All SNF Paul G Allen L107 Cleanroom

3 Probe Heads for different cleanliness groups.

Samco PC300 Plasma Etch System
samco
Samco Training Flexible SNF Paul G Allen L107 Cleanroom
Tystar Bank 3 Tube 11 TEOS
B3T11 Clean TEOS
Tystar LPCVD Tube Training Clean SNF Paul G Allen L107 Cleanroom
PlasmaTherm Versaline HDP CVD System
hdpcvd
PlasmaTherm Versaline HDP CVD System Training All SNF Paul G Allen L107 Cleanroom

To maintain cleanliness level there are cleans required for both the chamber and wafers prior to processing -

Substrates in clean category: Pre-Diffusion Clean

For semi-clean substrates: Standard Metal Clean (SRS100 + PRS1000) .  Run Chamber clean (no dummies) and conditioning with clean dummies prior to run

Critical Point Dryer Tousimis Automegasamdri-936
cpd
Critical Point Dryer Training Flexible SNF Paul G Allen L107 Cleanroom

CO2 drying after release of micromachined devices

HMDS Vapor Prime Oven, YES
yes
YES Prime Oven Training All SNF Paul G Allen L107 Cleanroom

Two programs: Singe and HMDS prime or Singe only. No Resist allowed!

Flexus 2320 Stress Tester
stresstest
Stress Tester Flexus 2320 Training All SNF Paul G Allen L107 Cleanroom
Lesker2 Sputter
lesker2-sputter
Sputter Lesker 1&2 Training Semiclean SNF Paul G Allen L107 Cleanroom

reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter

Tystar Bank 2 Tube 8 LTO
B2T8 Clean LTO
Tystar LPCVD Tube Training Clean SNF Paul G Allen L107 Cleanroom
Wet Bench Clean_res- hotphos
wbclean_res-hotphos
Wet Bench Clean Piranha/HF/Phosphoric Training Clean SNF Paul G Allen L107 Cleanroom

Resist should have been removed

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Equipment name & NEMO ID Technique Cleaning Required Cleanliness Primary Materials Etched Other Materials Etched Material Thickness Range Materials Lab Supplied Process Temperature Range Gases Substrate Size Substrate Type Maximum Load
Nanospec 3
nanospec3
All
Optomec Printer
optomec-printer
Flexible
Oven (White)
white-oven
Flexible
0 °C - 200 °C
,
,
,
,
,
,
,
,
Oven 110°C post-bake
oven110
All
110 ºC
,
,
,
,
,
,
,
,
,
Oven 90°C prebake
oven90
All
90 ºC
,
,
,
,
,
,
,
,
Oven BlueM 200°C to 430°C
bluem
Flexible
0 °C - 430 °C
,
,
,
,
,
,
,
,
,
Oxford Dielectric Etcher
oxford-rie
Flexible
,
,
,
,
1
Oxford III-V etcher
Ox-35
Flexible
1
Oxford Plasma Pro ICP-RIE
Ox-gen
Clean
-10 °C - 60 °C
,
,
1
PDS 2010 LABCOTER™ 2 Parylene Deposition System
parcoater
Flexible ,
,
,
,
,
,
,
,
,
,
,
,
Plasma Therm Versaline LL ICP Deep Silicon Etcher
PT-DSE
Flexible
1
Plasma Therm Versaline LL ICP Dielectric Etcher
PT-Ox
Flexible
1
Plasma Therm Versaline LL ICP Metal Etcher
PT-MTL
Flexible
1
Plasmaetch PE-50
plasma-etch
Flexible Multiple
PlasmaTherm Shuttlelock PECVD System
ccp-dep
All
100.00 Å - 4.00 μm
100 °C - 350 °C
,
,
,
,
,
,
,
,
4
PlasmaTherm Versaline HDP CVD System
hdpcvd
All
500.00 Å - 4.00 μm
50 °C - 150 °C
1
Profilometer Alphastep 500
alphastep
Flexible ,
,
,
,
,
,
,
,
1
Profilometer AlphaStep D-300
alphastep2
Flexible ,
,
,
,
,
,
,
,
,
,
,
,
1
Prometrix Resistivity Mapping System
prometrix
All ,
,
,
,
,
,
,
,
1
RTA AllWin 610
aw610_l
Pre-Diffusion Clean Clean
21 °C - 1150 °C
,
,
1 wafer

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