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4 inch wafer

Short Name: 
4"

The following is a list of equipment where 4 inch round substrates are allowed.

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Equipment name & NEMO ID Training Required & Charges Cleanliness Locationsort descending Notes
Tystar Bank 1 Tube 2
B1T2 Flexible Oxide
Tystar Atmospheric Tube Training Flexible SNF Paul G Allen L107 Cleanroom
Fiji 3 ALD
fiji3
ALD Fiji 3 Training Flexible SNF Paul G Allen L107 Cleanroom

Restricted to non-conductive films only

Wet Bench Miscellaneous
wbmiscres
Wet Bench Miscellaneous Photoresist Training Flexible SNF Paul G Allen L107 Cleanroom

Manual development of resist in beakers and Headway (manual resist spinner). SNF approved developers (acid or base). No solvents!

Matrix Plasma Resist Strip
matrix
Matrix Plasma Resist Strip Training Flexible SNF Paul G Allen L107 Cleanroom

Single wafer tool with auto loading from a cassette. Pieces need a pocket carrier wafer for transport. Chuck temperature controls wafer heating.

Karl Suss MA-6 Contact Aligner
karlsuss2
Contact Aligner Karl Suss MA-6 Training All SNF Paul G Allen L107 Cleanroom

1:1 Contact Aligner.
Backside align.

SVG Develop Track 2
svgdev2
SVG Resist Develop tracks 1 and 2 Training All SNF Paul G Allen L107 Cleanroom

Automatic development.

Tystar Bank 2 Tube 5
B2T5 Clean Anneal
Tystar Atmospheric Tube Training Clean SNF Paul G Allen L107 Cleanroom
MVD
mvd
MVD Training Flexible SNF Paul G Allen L107 Cleanroom

Reactor located inside glovebox

Wet Bench Resist Strip
wbresstrip-1
Wet Bench Resist Strip Clean (Ge), Semiclean, Flexible SNF Paul G Allen L107 Cleanroom

Wet Resist Removal: SRS-100 or PRS1000

Xactix Xenon Difluoride Etcher
xactix
Xactix Xenon Difluoride Etcher Training All SNF Paul G Allen L107 Cleanroom

Isotropic Si etching; can be used for backside Si removal on small pieces

Karl Suss MA-6 Contact Aligner
karlsuss
Contact Aligner Karl Suss MA-6 Training All SNF Paul G Allen L107 Cleanroom

1:1 Contact Aligner.
Backside align, including IR.

Nanospec 3
nanospec3
Nanospec 3 Training All SNF Paul G Allen L107 Cleanroom
Tystar Bank 2 Tube 6
B2T6 Clean Oxide
Tystar Atmospheric Tube Training Clean SNF Paul G Allen L107 Cleanroom
Savannah ALD
savannah
ALD Savannah Training Flexible SNF Paul G Allen L107 Cleanroom
Wet Bench Clean_res-hf
wbclean_res-hf
Wet Bench Clean Piranha/HF/Phosphoric Training Clean SNF Paul G Allen L107 Cleanroom

Resist as mask allowed

Plasma Therm Versaline LL ICP Deep Silicon Etcher
PT-DSE
Plasma Therm Versaline LL ICP Deep Silicon Etcher Training Flexible SNF Paul G Allen L107 Cleanroom

Single wafer; Bosch process for Si etching; Default 4" config; Can be converted to 6" config; pieces need to be attached to carrier wafer; need a support wafer for through wafer etching, can be used for Isotropic Si Etching

ASML PAS 5500/60 i-line Stepper
asml
Stepper ASML PAS 5500/60 i-line Training All SNF Paul G Allen L107 Cleanroom

5:1 reducing stepper

Tystar Bank 3 Tube 9
B3T9 Clean Oxide
Tystar Atmospheric Tube Training Clean SNF Paul G Allen L107 Cleanroom
Woollam
woollam
Woollam Training All SNF Paul G Allen L107 Cleanroom
Wet Bench Flexcorr 4
wbflexcorr-4
Wet Bench Flexcorr 1and2 and 3and4 Training Flexible SNF Paul G Allen L107 Cleanroom

Manual wet etching of non-standard materials using acids or bases. Hot plate, HF bath, and controlled temperature bath available. GaAs not allowed.

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Equipment name & NEMO ID Technique Cleaning Required Cleanliness Primary Materials Etched Other Materials Etched Material Thickness Range Materials Lab Supplied Process Temperature Range Gases Substrate Size Substrate Type Maximum Load
Nanospec 3
nanospec3
All
Optomec Printer
optomec-printer
Flexible
Oven (White)
white-oven
Flexible
0 °C - 200 °C
,
,
,
,
,
,
,
,
Oven 110°C post-bake
oven110
All
110 ºC
,
,
,
,
,
,
,
,
,
Oven 90°C prebake
oven90
All
90 ºC
,
,
,
,
,
,
,
,
Oven BlueM 200°C to 430°C
bluem
Flexible
0 °C - 430 °C
,
,
,
,
,
,
,
,
,
Oxford Dielectric Etcher
oxford-rie
Flexible
,
,
,
,
1
Oxford III-V etcher
Ox-35
Flexible
1
Oxford Plasma Pro ICP-RIE
Ox-gen
Clean
-10 °C - 60 °C
,
,
1
PDS 2010 LABCOTER™ 2 Parylene Deposition System
parcoater
Flexible ,
,
,
,
,
,
,
,
,
,
,
,
Plasma Therm Versaline LL ICP Deep Silicon Etcher
PT-DSE
Flexible
1
Plasma Therm Versaline LL ICP Dielectric Etcher
PT-Ox
Flexible
1
Plasma Therm Versaline LL ICP Metal Etcher
PT-MTL
Flexible
1
Plasmaetch PE-50
plasma-etch
Flexible Multiple
PlasmaTherm Shuttlelock PECVD System
ccp-dep
All
100.00 Å - 4.00 μm
100 °C - 350 °C
,
,
,
,
,
,
,
,
4
PlasmaTherm Versaline HDP CVD System
hdpcvd
All
500.00 Å - 4.00 μm
50 °C - 150 °C
1
Profilometer Alphastep 500
alphastep
Flexible ,
,
,
,
,
,
,
,
1
Profilometer AlphaStep D-300
alphastep2
Flexible ,
,
,
,
,
,
,
,
,
,
,
,
1
Prometrix Resistivity Mapping System
prometrix
All ,
,
,
,
,
,
,
,
1
RTA AllWin 610
aw610_l
Pre-Diffusion Clean Clean
21 °C - 1150 °C
,
,
1 wafer

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