The following is a list of equipment where 4 inch round substrates are allowed.
Two programs: Singe and HMDS prime or Singe only. No Resist allowed!
Isotropic Si etching; can be used for backside Si removal on small pieces
Wet Resist Removal: SRS-100 or PRS1000
Manual development of resist in beakers and Headway (manual resist spinner). SNF approved developers (acid or base). No solvents!
Manual solvent cleaning of substrates or resist removal.
Manual solvent cleaning, two ultrasonic baths.
Manual solvent cleaning, hot plate
Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only.
Manual wet etching of non-standard materials. Hot pots available. GaAs allowed in personal labware only
Manual wet etching of non-standard materials using acids or bases. Hot plate, HF bath, and controlled temperature bath available. GaAs not allowed.
Manual wet etching of non-standard materials using acids or bases. Hot Plate available. GaAs not allowed.
Al, Ti, or W wet etching or oxide etching
Resist should have been removed
Resist as mask allowed
Resist will be removed
Manual development of resist in beakers. SNF approved developers only. No solvents!
Automatic development.