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4 inch wafer

Short Name: 
4"

The following is a list of equipment where 4 inch round substrates are allowed.

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Equipment name & NEMO ID Training Required & Chargessort ascending Cleanliness Location Notes
Lesker2 Sputter
lesker2-sputter
Sputter Lesker 1&2 Training Semiclean SNF Paul G Allen L107 Cleanroom

reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter

Lesker Sputter
lesker-sputter
Sputter Lesker 1&2 Training Flexible SNF Exfab Paul G Allen 155A Venice

reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter

Samco PC300 Plasma Etch System
samco
Samco Training Flexible SNF Paul G Allen L107 Cleanroom
Technics Asher
technics
Technics Asher Training Flexible SNF Paul G Allen L107 Cleanroom
LEI1500 Contactless Sheet Resistance Mapping
eddycurrent
LEI1500 Contactless Sheet Resistance Mapping Training "All" SNF Exfab Paul G Allen 151 Ocean
Wet Bench Decontamination
wbdecon
Wet Bench Decontamination Training Clean SNF Paul G Allen L107 Cleanroom

KOH or wafersaw or post-cmp decontamination

Headway 3 Manual Resist Spinner
headway3
Resist Coat (manual) Headway 3 Training "All" SNF Exfab Paul G Allen 104 Stinson
Nanospec 3
nanospec3
Nanospec 3 Training "All" SNF Paul G Allen L107 Cleanroom
Keyence Digital Microscope VHX-6000
keyence
Microscope Keyence Training "All" SNF Exfab Paul G Allen 104 Stinson
PDS 2010 LABCOTER™ 2 Parylene Deposition System
parcoater
Parylene Coater Training Flexible SNF Exfab Paul G Allen 155 Mavericks
Heidelberg MLA 150 - 2
heidelberg2
Heidelberg Training "All" SNF Paul G Allen L107 Cleanroom

Direct Write

Heidelberg MLA 150
heidelberg
Heidelberg Training "All" SNF Exfab Paul G Allen 104 Stinson

Direct Write

AJA Evaporator
aja-evap
Evaporator AJA training Flexible SNF Exfab Paul G Allen 155A Venice

For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance

PlasmaTherm Versaline HDP CVD System
hdpcvd
PlasmaTherm Versaline HDP CVD System Training "All" SNF Paul G Allen L107 Cleanroom

To maintain cleanliness level there are cleans required for both the chamber and wafers prior to processing -

Substrates in clean category: Pre-Diffusion Clean

For semi-clean substrates: Standard Metal Clean (SRS100 + PRS1000) .  Run Chamber clean (no dummies) and conditioning with clean dummies prior to run

Oven (White)
white-oven
White Oven Training Flexible SNF Paul G Allen L107 Cleanroom

For LOL2000 bake or bakes which are not allowed in the other ovens and need higher temperatures, up to 200C, programmable.

Flexus 2320 Stress Tester
stresstest
Stress Tester Flexus 2320 Training "All" SNF Paul G Allen L107 Cleanroom
Sensofar S-neox
s-neox
Sensofar S-neox Training "All" SNF Paul G Allen L107 Cleanroom

non contact 3D optical profiling

Intlvac Evaporator
Intlvac_evap
Evaporator Intlvac Training Clean, Semiclean SNF Paul G Allen L107 Cleanroom
HMDS Vapor Prime Oven, YES
yes
YES Prime Oven Training "All" SNF Paul G Allen L107 Cleanroom

Two programs: Singe and HMDS prime or Singe only. No Resist allowed!

Xactix Xenon Difluoride Etcher
xactix
Xactix Xenon Difluoride Etcher Training "All" SNF Paul G Allen L107 Cleanroom

Isotropic Si etching; can be used for backside Si removal on small pieces

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Equipment name & NEMO ID Technique Cleanliness Primary Materials Etched Other Materials Etched Material Thickness Range Materials Lab Supplied Materials User Supplied Minimum Resolution Exposure Wavelength Mask Size Max Exposure Area Resist Process Temperature Range Chemicals Gases Sample Size Limits Resolution Notes Substrate Size Substrate Type Maximum Load
Headway 3 Manual Resist Spinner
headway3
"All" 1 piece or wafer
Headway Manual Resist Spinner
headway2
"All" ,
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one piece or wafer
Heidelberg MLA 150
heidelberg
"All"
405 nm ,
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1
Heidelberg MLA 150 - 2
heidelberg2
"All"
375 nm ,
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1
HMDS Vapor Prime Oven, YES
yes
"All"
150 ºC
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Intlvac Evaporator
Intlvac_evap
Clean, Semiclean
0.00 - 0.50 μm
,
,
12 4 inch wafers, 2 6 inch wafers
Karl Suss MA-6 Contact Aligner
karlsuss
"All"
365 nm 4 inch, 5 inch, 7 inch 5 inch mask = 4 inch, 7 inch mask = 6 inch, 4 inch mask = 3 inch ,
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Karl Suss MA-6 Contact Aligner
karlsuss2
"All"
365 nm or 405 nm 4 inch, 5 inch, 7 inch 5 inch mask = 4 inch, 7 inch mask = 6 inch, 4 inch mask = 3 inch ,
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Keyence Digital Microscope VHX-6000
keyence
"All" ,
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KJL Evaporator 1
200.00 nm
1
Lam Research TCP 9400 Poly Etcher
lampoly
Clean, Semiclean
,
25
Laurell Manual Resist Spinner
laurell-R
"All"
LEI1500 Contactless Sheet Resistance Mapping
eddycurrent
"All" 8 in wafer

Sensor Transducer Size is 14 mm diameter 

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1 wafer(2" to 8")
Lesker Sputter
lesker-sputter
Flexible ,
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1 4 inch wafer, 1 6 inch wafer
Lesker2 Sputter
lesker2-sputter
Semiclean
1.00 μm
°C - 800 °C
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one 4 inch wafer, one 6 inch wafer
Matrix Plasma Resist Strip
matrix
Flexible
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25
micromanipulator6000 IV-CV probe station
micromanipulator6000
"All" ,
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1x4" wafer
MRC Reactive Ion Etcher
mrc
Flexible 1
MVD
mvd
Flexible
1.00 Å - 50.00 nm
24 °C - 150 °C
Nanospec 210XP
nanospec2
"All" ,
,
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,
,
,
,
,

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