The following is a list of equipment where 4 inch round substrates are allowed.
3 Probe Heads for different cleanliness groups.
Manual development of resist in beakers. SNF approved developers only. No solvents!
Manual Film Thickness Measurement. Single or dual layer transparent films > 300 Ã
Direct Write
500Å to 300µm
No resist allowed. Resist should have been removed at the wbclean_res-piranha
Manual wet etching of non-standard materials. Hot pots available. GaAs allowed in personal labware only
Single wafer tool with auto loading from a cassette. Pieces need a pocket carrier wafer for transport. Wafers heated by lamps.
Bakes wafers with resist after the development, called post-bake.
Automatic development.