The following is a list of equipment where 3 inch round substrates are allowed.
3 Probe Heads for different cleanliness groups.
Manual Film Thickness Measurement. Single or dual layer transparent films > 300 Ã
Direct Write
500Å to 300µm
Manual development of resist in beakers. SNF approved developers only. No solvents!
Resist will be removed
1:1 Contact Aligner. Backside align, including IR.
Adjustable spin speeds, spin time. SNF-acceptable resists or polymers. Ebeam resists
Manual wet etching of non-standard materials using acids or bases. Hot Plate available. GaAs not allowed.
Manual solvent cleaning of substrates or resist removal.
CO2 drying after release of micromachined devices