The following is a list of equipment where 2 inch round substrates are allowed.
Manual solvent cleaning, hot plate
1:1 Contact Aligner. Backside align, including IR.
Manual solvent cleaning of substrates or masks. Teflon coated metal tweezers cleaning.
Direct Write
Manual wet etching of non-standard materials using acids or bases. Hot Plate available. GaAs not allowed.
Restricted to non-conductive films only
Manual solvent cleaning of substrates or resist removal.
reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter
Reactor located inside glovebox