The following is a list of equipment where 2 inch round substrates are allowed.
SU-8, LOL, Ebeam resists allowed. No Acetone allowed.
1:1 Contact Aligner. Backside align.
1:1 Contact Aligner. Backside align, including IR.
Two programs: Singe and HMDS prime or Singe only. No Resist allowed!
Direct Write
Adjustable spin speeds, spin time. SNF-acceptable resists or polymers. Ebeam resists
Aligned single-walled carbon nanotube growth with ST-cut quartz substrates (available from SNF stockroom);1-15 single-walled carbon nanotubes per micron density
Restricted to non-conductive films only
Manual development of resist in beakers. SNF approved developers only. No solvents!
Spray coating of resists
CO2 drying after release of micromachined devices
For more than 300nm deposition, please contact Neel Mehta <nmehta26@stanford.edu> in advance