The following is a list of equipment where 2 inch round substrates are allowed.
Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only.
Two programs: Singe and HMDS prime or Singe only. No Resist allowed!
Manual wet etching of non-standard materials. Hot pots available. GaAs allowed in personal labware only
For LOL2000 bake or bakes which are not allowed in the other ovens and need higher temperatures, up to 200C, programmable.
Manual development of resist in beakers and Headway (manual resist spinner). SNF approved developers (acid or base). No solvents!
Convection in N2. Cure. Programmable.
Wet Resist Removal: SRS-100 or PRS1000
Bakes wafers with resist after the development, called post-bake.
Manual wet etching of non-standard materials using acids or bases. Hot plate, HF bath, and controlled temperature bath available. GaAs not allowed.
Bakes wafers after resist coating.
Manual solvent cleaning, two ultrasonic baths.
1:1 Contact Aligner. Backside align.
reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter