The following is a list of equipment where 2 inch round substrates are allowed.
Manual development of resist in beakers. SNF approved developers only. No solvents!
Manual Film Thickness Measurement. Single or dual layer transparent films > 300 Ã
500Å to 300µm
Direct Write
Manual development of resist in beakers and Headway (manual resist spinner). SNF approved developers (acid or base). No solvents!
Convection in N2. Cure. Programmable.
Wet Resist Removal: SRS-100 or PRS1000
Bakes wafers with resist after the development, called post-bake.
Manual wet etching of non-standard materials using acids or bases. Hot plate, HF bath, and controlled temperature bath available. GaAs not allowed.
Bakes wafers after resist coating.
Manual solvent cleaning, two ultrasonic baths.
1:1 Contact Aligner. Backside align.
Manual solvent cleaning, hot plate
1:1 Contact Aligner. Backside align, including IR.