The following is a list of equipment where 2 inch round substrates are allowed.
Adjustable spin speeds, spin time. SNF-acceptable resists or polymers. Ebeam resists
1:1 Contact Aligner. Backside align.
1:1 Contact Aligner. Backside align, including IR.
SU-8, LOL, Ebeam resists allowed. No Acetone allowed.
Manual solvent cleaning of substrates or masks. Teflon coated metal tweezers cleaning.
Typically used for sputter etching; Single wafer, direct load system; wafers/ pieces can be directly placed on electrode
Manual Film Thickness Measurement. Single or dual layer transparent films > 300 Ã
Low power, high pressure plasma; low bias, minimal damage. Often used for surface treatment.
3 Probe Heads for different cleanliness groups.
Pieces need a carrier wafer; Isotropic Etching
Manual development of resist in beakers. SNF approved developers only. No solvents!
Manual wet etching of non-standard materials using acids or bases. Hot plate, HF bath, and controlled temperature bath available. GaAs not allowed.
Manual wet etching of non-standard materials using acids or bases. Hot Plate available. GaAs not allowed.
Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only.
Manual wet etching of non-standard materials. Hot pots available. GaAs allowed in personal labware only