The "Clean" cleanliness group is part of the SNF/ExFab contamination policy.
The following is a list of equipment that fall into the "Clean" category.
Equipment name & NEMO ID | Training Required & Charges | Cleanliness |
Location![]() |
Notes |
---|---|---|---|---|
RTA AllWin 610 aw610_l |
AllWin 610 RTA Training | Clean | SNF Paul G Allen L107 Cleanroom | |
Intlvac Evaporator Intlvac_evap |
Evaporator Intlvac Training | Clean, Semiclean | SNF Paul G Allen L107 Cleanroom | |
Wet Bench Clean 2 wbclean-2 |
Wet Bench Clean1and2 Training | Clean | SNF Paul G Allen L107 Cleanroom |
No resist allowed. Resist should have been removed at the wbclean_res-piranha |
Lesker2 Sputter lesker2-sputter |
Sputter Lesker 1&2 Training | Semiclean | SNF Paul G Allen L107 Cleanroom |
reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter |
Aixtron MOCVD - III-N system aix-ccs |
MOCVD - III-N Aixtron training | Clean (MOCVD) | SNF MOCVD Paul G Allen 213XA |
N and P doping available. |
Equipment name & NEMO ID | Technique | Cleanliness | Primary Materials Etched | Process Temperature Range | Chemicals | Substrate Size | Substrate Type | Maximum Load |
---|---|---|---|---|---|---|---|---|
Wet Bench Clean_res-hf wbclean_res-hf |
Clean |
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Wet Bench Clean_res-piranha wbclean_res-piranha |
Clean |
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Wet Bench CMOS Metal wbclean3 |
Semiclean |
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25 wafers | |||||
Wet Bench Decontamination wbdecon |
Clean |
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Wet Bench Resist Strip wbresstrip-1 |
Clean (Ge), Semiclean, Flexible |
20 °C - 60 °C
|
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25 4 inch wafers |