The "Clean" cleanliness group is part of the SNF/ExFab contamination policy.
The following is a list of equipment that fall into the "Clean" category.
Equipment name & NEMO ID | Training Required & Charges | Cleanliness |
Location![]() |
Notes |
---|---|---|---|---|
Wet Bench Clean_res-hf wbclean_res-hf |
Wet Bench Clean Piranha/HF/Phosphoric Training | Clean | SNF Paul G Allen L107 Cleanroom |
Resist as mask allowed |
Tystar Bank 2 Tube 7 Nitride B2T7 Clean Nitride |
Tystar LPCVD Tube Training | Clean | SNF Paul G Allen L107 Cleanroom | |
Wet Bench Decontamination wbdecon |
Wet Bench Decontamination Training | Clean | SNF Paul G Allen L107 Cleanroom |
KOH or wafersaw or post-cmp decontamination |
Tystar Bank 3 Tube 11 TEOS B3T11 Clean TEOS |
Tystar LPCVD Tube Training | Clean | SNF Paul G Allen L107 Cleanroom | |
Aixtron MOCVD - III-N system aix-ccs |
MOCVD - III-N Aixtron training | Clean (MOCVD) | SNF MOCVD Paul G Allen 213XA |
N and P doping available. |
Equipment name & NEMO ID | Technique | Cleanliness | Primary Materials Etched | Process Temperature Range | Chemicals | Substrate Size | Substrate Type | Maximum Load |
---|---|---|---|---|---|---|---|---|
Wet Bench Clean_res-hf wbclean_res-hf |
Clean |
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Wet Bench Clean_res-piranha wbclean_res-piranha |
Clean |
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Wet Bench CMOS Metal wbclean3 |
Semiclean |
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25 wafers | |||||
Wet Bench Decontamination wbdecon |
Clean |
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Wet Bench Resist Strip wbresstrip-1 |
Clean (Ge), Semiclean, Flexible |
20 °C - 60 °C
|
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25 4 inch wafers |