The "Semiclean" cleanliness group is part of the SNF/ExFab contamination policy.
The following is a list of equipment that fall into the "Semiclean" category.
Stanford Nanofabrication Facility
Lab User Guide
Equipment Tables
Equipment name & NEMO ID |
Technique | Cleanliness | Primary Materials Etched | Other Materials Etched | Material Thickness Range | Materials Lab Supplied | Process Temperature Range | Chemicals | Gases | Substrate Size | Substrate Type | Maximum Load |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Wet Bench Resist Strip wbresstrip-1 |
Clean (Ge), Semiclean, Flexible |
20 °C - 60 °C
|
25 4 inch wafers | |||||||||
|
Wet Bench CMOS Metal wbclean3 |
Semiclean | 25 wafers | ||||||||||
|
Oxford Plasma Pro PECVD Ox-PECVD |
Semiclean, Flexible |
100.00 Å -
4.00 μm
|
200 °C - 350 °C
|
1 | ||||||||
|
Lesker2 Sputter lesker2-sputter |
Semiclean |
1.00 μm
|
°C - 800 °C
|
one 4 inch wafer, one 6 inch wafer | ||||||||
|
Lam Research TCP 9400 Poly Etcher lampoly |
Clean, Semiclean | 25 | ||||||||||
|
Intlvac Evaporator Intlvac_evap |
Clean, Semiclean |
0.00 -
0.50 μm
|
12 4 inch wafers, 2 6 inch wafers | |||||||||
|
Gasonics Aura Asher gasonics |
Clean, Semiclean | 25 | ||||||||||
|
Fiji 1 ALD fiji1 |
Semiclean |
1.00 Å -
50.00 nm
|
24 °C - 350 °C
|