Etching is a broad term that is used to describe the removal of material from your sample. The sub categories may be helpful for narrowing down your search, and be aware that there may be more than one technique and/or tool that could be used for your process. 

  • Dry etching uses gaseous chemistries and plasma energy to etch materials from the sample. 
  • Wet etching uses liquid chemistries to etch materials from samples. 
  • Vapor etching uses HF Vapor to etch materials. It is primarily used to etch structures that would be damaged during the rinse and dry process in a standard wet etch.
Processing Techniques Equipment name & NEMO ID Teaser Blurb Cleanliness Location
Plasma Mode Etching, Reactive Ion Etching (RIE), Downstream/Remote Plasma Resist Removal Samco PC300 Plasma Etch System
samco

The SAMCO etcher is a multifunctional etcher that can operate in either the RIE, plasma etch or Downstream plasma modes

Flexible SNF Paul G Allen L107 Cleanroom
Inductively Coupled Plasma Etching (ICP) Oxford Plasma Pro ICP-RIE
Ox-gen
Flexible SNF Paul G Allen L107 Cleanroom
Inductively Coupled Plasma Etching (ICP) Oxford Plasma Pro ICP-RIE ALE
Ox-ALE

Oxford ICP-RIE Atomic Layer Etching (OX-ALE) is an Inductively Coupled Plasma (ICP) etch system designed for high-precision etching of silicon-based materials, III-V semiconductors, and 2D materials.

Flexible SNF Paul G Allen L107 Cleanroom
Inductively Coupled Plasma Etching (ICP) Oxford Plasma Pro ICP-RIE Ox
Ox-Ox

Oxford ICP-RIE Oxide Etcher (Ox-Ox) is an Inductively Coupled Plasma (ICP) etch system optimized for high-precision etching of silicon-based materials

Clean SNF Paul G Allen L107 Cleanroom

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