Etching is a broad term that is used to describe the removal of material from your sample. The sub categories may be helpful for narrowing down your search, and be aware that there may be more than one technique and/or tool that could be used for your process. 

  • Dry etching uses gaseous chemistries and plasma energy to etch materials from the sample. 
  • Wet etching uses liquid chemistries to etch materials from samples. 
  • Vapor etching uses HF Vapor to etch materials. It is primarily used to etch structures that would be damaged during the rinse and dry process in a standard wet etch.
Processing Techniques Equipment name & NEMO ID Teaser Blurb Cleanliness Locationsort ascending
Silicon Nitride Wet Etching, Wet Chemical Processing Wet Bench Clean_res- hotphos
wbclean_res-hotphos

Semi-automated wet bench for etching silicon nitride from 3", 4", and 6" Si, SiGe, and quartz substrates using 155C phosphoric acid. The baths can hold up to 25 wafers. Part of the Clean Cleanliness Group.

 Clean SNF Paul G Allen L107 Cleanroom
Vapor Etching SPTS uetch vapor etch
uetch

The SPTS uetch vapor system uses anhydrous HF and ethanol at reduced pressure and 45C to etch isotropically sacrificial silicon oxide layers, primarily to release silicon microstructures in MEMS devices.

 "All" SNF Paul G Allen L107 Cleanroom
Decontamination, Metal Clean, Piranha Cleaning, Wet Resist Removal, Acid or Base Wet Etching, Aluminum and Titanium and Tungsten Wet Etching, Silicon Wet Etching, Silicon Oxide Wet Etching, Wet Chemical Processing Wet Bench Flexcorr 1
wbflexcorr-1

Manual wet etching of non-standard materials using only SNF approved acids or bases. Hot plate available. GaAs allowed in personal labware only.

 Flexible SNF Paul G Allen L107 Cleanroom
Dry Resist Removal, Dry Etching Technics Asher
technics

Technics PE II-A is used for descum, resist strip and surface treatment with O2 plasma

 Flexible SNF Paul G Allen L107 Cleanroom

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