Processing Techniques Equipment name & NEMO IDsort descending Teaser Blurb Cleanliness Location
Vapor Etching SPTS uetch vapor etch
uetch

The SPTS uetch vapor system uses anhydrous HF and ethanol at reduced pressure and 45C to etch isotropically sacrificial silicon oxide layers, primarily to release silicon microstructures in MEMS devices.

"All" SNF Paul G Allen L107 Cleanroom
Vapor Etching Xactix Xenon Difluoride Etcher
xactix

The Xactix e-1 is a XeF2 (xenon difluoride) isotropic silicon etcher.

"All" SNF Paul G Allen L107 Cleanroom