There are many options available to remove resist from your substrate. Dry methods use plasma O2 to react with the resist, while wet methods use either solvents to dissolve the resist or oxidizing chemistries to react with the resist. For processes that are sensitive to resist residues, resist removal can consist of both a dry and a wet clean. 

The cleaning method you will need will depend on the materials on your substrate as well as your substrate itself in addition cleanliness category of your sample. (For more about the cleanliness categories, please visit the Cleanliness (previously Contamination) Groups page).

Processing Technique Equipment name & NEMO IDsort descending Cleanliness Chemicals Primary Materials Etched Other Materials Etched Substrate Size Maximum Load (number of wafers) Process Temperature Range Gases Notes Stylus Tip Radius
Downstream/Remote Plasma Resist Removal, Downstream/Remote Plasma Etching Gasonics Aura Asher
gasonics 		Clean, Semiclean
25

Single wafer tool with auto loading from a cassette. Pieces need a pocket carrier wafer for transport. Wafers heated by lamps.
Downstream/Remote Plasma Resist Removal, Downstream/Remote Plasma Etching Matrix Plasma Resist Strip
matrix 		Flexible
25

Single wafer tool with auto loading from a cassette. Pieces need a pocket carrier wafer for transport. Chuck temperature controls wafer heating.
Plasma Mode Etching, Reactive Ion Etching (RIE), Downstream/Remote Plasma Resist Removal Samco PC300 Plasma Etch System
samco 		Flexible
Four 4" wafers or two 6" wafers and one 8" wafer
20 ºC
Dry Resist Removal, Dry Etching Technics Asher
technics 		Flexible
Four 4" wafers to pieces, one 6" or 8" wafer
Piranha Cleaning, Wet Resist Removal, Wet Chemical Processing Wet Bench Clean_res-piranha
wbclean_res-piranha 		Clean

Resist will be removed
Decontamination, Metal Clean, Piranha Cleaning, Wet Resist Removal, Acid or Base Wet Etching, Aluminum and Titanium and Tungsten Wet Etching, Silicon Wet Etching, Silicon Oxide Wet Etching, Wet Chemical Processing Wet Bench Flexcorr 1
wbflexcorr-1 		Flexible

Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only.
Solvent Cleaning, Wet Resist Removal, Metal Lift-off Wet Bench Flexible Solvents
wbflexsolv 		Flexible

Manual solvent cleaning of substrates or resist removal.
Solvent Cleaning, Wet Resist Removal, Wet Chemical Processing Wet Bench Flexible Solvents 1
wbflexsolv-1 		Flexible

Manual solvent cleaning, two ultrasonic baths.
Solvent Cleaning, Wet Resist Removal, Wet Chemical Processing Wet Bench Flexible Solvents 2
wbflexsolv-2 		Flexible

Manual solvent cleaning, hot plate
Wet Resist Removal, Wet Chemical Processing Wet Bench Resist Strip
wbresstrip-1 		Clean (Ge), Semiclean, Flexible
25 4 inch wafers
20 °C - 60 °C

Wet Resist Removal: SRS-100 or PRS1000