Wet methods use either solvents or acids/bases to dissolve the resist in order to remove it from the substrate.

The wet bench you need will depend on the materials on your substrate as well as your substrate itself in addition cleanliness category of your sample. (For more about the cleanliness categories, please visit the Cleanliness (previously Contamination) Groups page).

 

Processing Technique Equipment name & NEMO ID Cleanliness Chemicals Primary Materials Etched Other Materials Etched Substrate Size Maximum Load (number of wafers)sort ascending Process Temperature Range Notes Stylus Tip Radius
Wet Resist Removal, Wet Chemical Processing Wet Bench Resist Strip
wbresstrip-1 		Clean (Ge), Semiclean, Flexible
25 4 inch wafers
20 °C - 60 °C

Wet Resist Removal: SRS-100 or PRS1000
Decontamination, Metal Clean, Piranha Cleaning, Wet Resist Removal, Acid or Base Wet Etching, Aluminum and Titanium and Tungsten Wet Etching, Silicon Wet Etching, Silicon Oxide Wet Etching, Wet Chemical Processing Wet Bench Flexcorr 1
wbflexcorr-1 		Flexible

Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only.
Solvent Cleaning, Wet Resist Removal, Wet Chemical Processing Wet Bench Flexible Solvents 1
wbflexsolv-1 		Flexible

Manual solvent cleaning, two ultrasonic baths.
Solvent Cleaning, Wet Resist Removal, Wet Chemical Processing Wet Bench Flexible Solvents 2
wbflexsolv-2 		Flexible

Manual solvent cleaning, hot plate
Piranha Cleaning, Wet Resist Removal, Wet Chemical Processing Wet Bench Clean_res-piranha
wbclean_res-piranha 		Clean

Resist will be removed
Solvent Cleaning, Wet Resist Removal, Metal Lift-off Wet Bench Flexible Solvents
wbflexsolv 		Flexible

Manual solvent cleaning of substrates or resist removal.