Downstream or remote plasma resist removal (also known as ashing) generates the plasma gases outside of the process chamber in order to minimize bombardment of the substrate surface.
| Processing Technique | Equipment name & NEMO ID | Cleanliness | Primary Materials Etched | Other Materials Etched | Substrate Size | Maximum Load (number of wafers) | Process Temperature Range | Gases | Notes | Stylus Tip Radius |
|---|---|---|---|---|---|---|---|---|---|---|
| Downstream/Remote Plasma Resist Removal, Downstream/Remote Plasma Etching |
Gasonics Aura Asher gasonics |
Clean, Semiclean | 25 |
Single wafer tool with auto loading from a cassette. Pieces need a pocket carrier wafer for transport. Wafers heated by lamps. |
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| Downstream/Remote Plasma Resist Removal, Downstream/Remote Plasma Etching |
Matrix Plasma Resist Strip matrix |
Flexible | 25 |
Single wafer tool with auto loading from a cassette. Pieces need a pocket carrier wafer for transport. Chuck temperature controls wafer heating. |
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| Plasma Mode Etching, Reactive Ion Etching (RIE), Downstream/Remote Plasma Resist Removal |
Samco PC300 Plasma Etch System samco |
Flexible | Four 4" wafers or two 6" wafers and one 8" wafer |
20 ºC
|