Processing Technique Equipment name & NEMO ID Cleanliness Chemicals Substrate Size Maximum Load (number of wafers) Process Temperature Range Developer Notessort descending Stylus Tip Radius
Wafer Prime (HMDS) HMDS Vapor Prime Oven, YES2
yes2
"All" 25
150 ºC

Singe and prime. No Resist allowed!

Wafer Prime (HMDS), Singe HMDS Vapor Prime Oven, YES
yes
"All"
150 ºC

Two programs: Singe and HMDS prime or Singe only. No Resist allowed!