Processing Technique Equipment name & NEMO ID Cleanliness Chemicals Substrate Size Maximum Load (number of wafers) Process Temperature Range Developer Notes Stylus Tip Radius
Wafer Prime (HMDS), Singe HMDS Vapor Prime Oven, YES
yes 		"All"
150 ºC

Two programs: Singe and HMDS prime or Singe only. No Resist allowed!
Wafer Prime (HMDS) HMDS Vapor Prime Oven, YES2
yes2 		"All" 25
150 ºC

Singe and prime. No Resist allowed!