Resists contain solvents which are used to control the viscosity of the materials during coating, and bakes are used to drive out solvents to control the resist patterning quality.
| Processing Techniques |
Equipment name & NEMO ID |
Teaser Blurb | Cleanliness | Location |
|---|---|---|---|---|
| Oven Bake |
Oven (White) white-oven |
Flexible | SNF Paul G Allen L107 Cleanroom | |
| Resist Post Bake |
Oven 110°C post-bake oven110 |
The 110°C Oven bakes the wafers with resist at 110ºC after the development, called post-bake. |
"All" | SNF Paul G Allen L107 Cleanroom |
| Resist Prebake |
Oven 90°C prebake oven90 |
The 90°C Oven is the 90°C prebake oven. It is used to bake wafers after resist coating. |
"All" | SNF Paul G Allen L107 Cleanroom |
| Oven Bake |
Oven BlueM 200°C to 430°C bluem |
The BlueM oven is for 200°C to 437°C temperature bakes, i.e. polyimide. |
Flexible | SNF Paul G Allen L107 Cleanroom |
| Resist UV Cure |
Ultraviolet Photoresist Cure uvcure |
Ultraviolet Photoresist Cure, primary wavelength is 254 nm. |
"All" | SNF Paul G Allen L107 Cleanroom |