For photolithography processing SNF houses three types of UV exposure tools: contact aligner, direct write (mask-less) system, and a stepper. All of these systems utilize near-UV sensitive photoresist for pattern transfer. Selection of the appropriate exposure tool depends upon the specifics of the project. Listed in each tool’s webpage specific capabilities such as resolution, alignment, and substrate handling capability are discussed.
| Processing Techniques | Equipment name & NEMO ID | Teaser Blurb | Cleanliness | Location |
|---|---|---|---|---|
| Stepper |
ASML PAS 5500/60 i-line Stepper asml |
ASML PAS 5500/60 i-line stepper, automatic for 25 inch wafers, 450nm resolution, 365nm near-UV light |
"All" | SNF Paul G Allen L107 Cleanroom |
| Direct Write |
Heidelberg MLA 150 heidelberg |
Maskless writer that patterns without prior fabrication of masks. |
"All" | SNF Exfab Paul G Allen 104 Stinson |
| Direct Write |
Heidelberg MLA 150 - 2 heidelberg2 |
Maskless writer that patterns without prior fabrication of masks. |
"All" | SNF Paul G Allen L107 Cleanroom |
| Contact Aligner |
Karl Suss MA-6 Contact Aligner karlsuss |
Karl Suss MA-6 Mask Aligner is a 1:1 Contact Aligner, 1.5 um resolution, single wafer, manual system (Backside align, including IR). |
"All" | SNF Paul G Allen L107 Cleanroom |
| Contact Aligner |
Karl Suss MA-6 Contact Aligner karlsuss2 |
Karl Suss MA-6 Mask Aligner is a 1:1 Contact Aligner, 1.5 um resolution, single wafer, manual system (Backside align, including IR). |
"All" | SNF Paul G Allen L107 Cleanroom |