50:1 Hydrofluoric Acid

50:1 Hydrofluoric Acid (50:1 HF)

Preferred Short Name:

50:1 HF

Chemical Formula:

50:1 HF

Full Chemical Name:

50:1 Hydrofluoric Acid (~2%)

50:1 HF is typically used as an oxide etchant.

Equipment name & NEMO ID	Training Required & Charges	Cleanliness	Location	Chemicals	Notes
Wet Bench Clean 1 wbclean-1	Wet Bench Clean1and2 Training 2.00 hours	Clean	SNF Paul G Allen L107 Cleanroom	50:1 HF SC1 SC2	No resist allowed. Resist should have been removed at the wbclean_res-piranha.
Wet Bench Clean 2 wbclean-2	Wet Bench Clean1and2 Training 2.00 hours	Clean	SNF Paul G Allen L107 Cleanroom	50:1 HF 6:1 BOE SC1 SC2	No resist allowed. Resist should have been removed at the wbclean_res-piranha
Wet Bench Clean_res-hf wbclean_res-hf	Wet Bench Clean Piranha/HF/Phosphoric Training 2.25 hours	Clean	SNF Paul G Allen L107 Cleanroom	20:1 BOE 50:1 HF 6:1 BOE	Resist as mask allowed
Wet Bench CMOS Metal wbclean3	Wet Bench CMOS Metal (wbclean3) Training	Semiclean	SNF Paul G Allen L107 Cleanroom	20:1 BOE 50:1 HF 6:1 BOE Al-Etch Ti-Etch W-etch	Al, Ti, or W wet etching or oxide etching
Wet Bench Flexcorr 1 wbflexcorr-1	Wet Bench Flexcorr 1and2 and 3and4 Training 2.00 hours	Flexible	SNF Paul G Allen L107 Cleanroom	Acids Bases Gold Etchant 20:1 BOE 50:1 HF 6:1 BOE 9:1 Piranha Al-Etch Chrome Etch KOH SC1 SC2	Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only.