Skip to content
Skip to navigation
Stanford Nanofabrication Facility
Navigation menu
Home
Tungsten
Chemical Formula:
W
Equipment Tabs
Deposition Equipment
Equipment name or Badger ID
Partial words okay.
Deposition Equipment
Equipment name & Badger ID
Cleanliness
Location
Material Thickness Range
Approved Materials supplied by Lab
Intlvac Evaporator
Intlvac_evap
Clean
Semiclean
SNF Cleanroom Paul G Allen L107
0.00
-
0.50 μm
Al
Co
Cr
Ge
Hf
Mo
Nb
Ni
Pd
Si
Ta
Ti
V
W
Zr
Lesker Sputter
lesker-sputter
Flexible
SNF Exfab Paul G Allen 155A Venice
Ag
Al
Al
2
O
3
AlSi
Au
Co
Cr
Cu
Fe
In
x
Sn
y
O
z
Nb
Ni
Pd
Si
SiO
2
Ta
Ti
TiN
W
Lesker2 Sputter
lesker2-sputter
Semiclean
SNF Cleanroom Paul G Allen L107
1.00 μm
Ag
Al
Al
2
O
3
AlSi
Cr
Ge
In
x
Sn
y
O
z
Mo
Pd
Ru
Sc
Si
SiO
2
Sn
Ta
Ti
TiN
W
Etching Equipment
Equipment name or Badger ID
Partial words okay.
Etch Equipment
Equipment name & Badger ID
Cleanliness
Location
Primary Materials Etched
Other Materials Etched
AMAT P5000 Etcher
p5000etch
Clean
Clean (Ge)
Semiclean
SNF Cleanroom Paul G Allen L107
Si
Si3N4
SiGe
SiO
2
SiON
C
C
C
dimethylpolysiloxane
poly(p-xylylene)
SiC
Ti
Various C-based
W
WSi
2
PI
Resist
Ti Tungsten
Wet Bench CMOS Metal
wbclean3
Semiclean
SNF Cleanroom Paul G Allen L107
Al
Ti
W
Wet Bench Flexcorr 1
wbflexcorr-1
Flexible
SNF Cleanroom Paul G Allen L107
Metals
Al
Au
Cr
Si
SiO
2
Resist
GaAs
Si3N4
Ti
W